Bga Glue
Overview
Product sourcing insights & recommendations
I have synthesized the latest market trends and product insights for 'BGA glue' (underfill adhesives). The global market is projected to reach USD 624 million by 2026, driven primarily by the needs of 5G infrastructure, AI chip packaging, and automotive electronics.
Key technical trends include a shift toward reworkable adhesives for smartphone repair and high-thermal-conductivity materials for heat dissipation in advanced semiconductors. The report below provides a detailed analysis of market size, growth drivers, and leading manufacturers, along with a selection of representative products ranging from repair-grade to high-performance industrial underfills.
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Bga Underfill Epoxy Adhesive For Smartphone Repair Reworkable
Products · 3 lists
JC JCID UF6008 Chip Underfill Glue Adhesive 5ml Black for SMT Repair BGA Repair Consumables PCB Reflow Masking Welding Paste
Shenzhen City Yixin Technology Co., Ltd.🇨🇳CN6 yrs
Epoxy Underfill One Component Repairable Fast Cure BGA CSP Solder Joint Protection Electronics CS2031
Guangdong Sirnice Industrial Co., Ltd.🇨🇳CN1 yr
WTS-7513 Underfill Adhesive/Encapsulant for CSP/BGA/uBGA Flip Chip
Guangdong Hongle New Materials Technology Co.,ltd🇨🇳CN16 yrs
SE8116 High Quality UNDERFILL GULE for Microdrop Chip
Yantai Seayu New Materials Co., Ltd.🇨🇳CN16 yrs
Seal-glo UF317H 30G Epoxy Resin Adhesive Used to Fix Chip Components on Pcb Underfill Glue Epoxy Glue for Sale
Shenzhen YLD Technology Co., Ltd.🇨🇳CN2 yrs
JC JCID UF6008 Chip Underfill Glue Adhesive 5ml Black for SMT Repair BGA Repair Consumables PCB Reflow Masking Welding Paste
Shenzhen Hyperion Lighting Co., Ltd.🇨🇳CN8 yrs
EUBO Modified Epoxy Underfill for CSP/BGA Packaging UV & Thermal Curing for E-paper, ESL, and Smart Card Applications
Shenzhen Youbao New Material Technology Co., Ltd.🇨🇳CN2 yrs
GTA High Temperature Composite Polymer Underfill Epoxy Flip Chip BGA Protection PCB Mounting Model Underfill CQ-836 Viscosity
GTA MATERIAL CO., LTD.🇹🇼TW2 yrs
Seal-glo NE3000S Underfill Epoxy Resin Adhesive 200G for PCB Chip Component Repair Transportation & Packing
Shenzhen Huazhisheng New Material Technology Co., Ltd.verified🇨🇳CN6 yrsDeep Dive · Full Report
Full Market Report
1 document · Live-fetched from source
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Sources & References
24 sources cited · Verified industry data & reports
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