Bga Kit For Mobile
Overview
Product sourcing insights & recommendations


The market for mobile BGA reballing kits is experiencing significant growth, projected to reach $947 million by 2035 with a steady demand for high-precision tools driven by rapid smartphone iterations MarketresearchintellectDiyfixtool.
Market Dynamics & Trends (2025-2026)
* Technological Shift: The industry is moving toward 3D Black Stencils and Magnetic Alignment Fixtures, which offer superior precision and reduce human error compared to traditional universal templates YoutubeYoutube.
* Material Preference: Stainless steel remains the gold standard for stencils (ideal thickness 0.06mm–0.15mm) due to its high heat resistance and durability against warping during repeated soldering cycles Diyfixtool.
* Sector Growth: While consumer repair remains strong, the FC-BGA market (projected to reach $6.53 billion by 2029) is being heavily fueled by aerospace and industrial sectors requiring extreme reliability Openpr.
Sourcing Insights
Recent data indicates that the most sought-after kits now integrate magnetic bases for rapid IC positioning and support for the latest chipsets (e.g., iPhone A17/A18, Qualcomm Snapdragon series). Suppliers like Shenzhen Liwei Electronic and Guangzhou Huiyuan Communication are leading the market with specialized OEM/ODM services for these high-precision tools AlibabaAlibaba.
I have compiled a list of 34 top-rated BGA kits and 66 specialized manufacturers that meet these modern criteria. The files below contain detailed specifications, pricing, and supplier capability tags for your review.
Based on these trends, would you like to:
Bga Reballing Kit For Mobile Phone Repair Iphone Samsung Magnetic 3d Stencil
Products · 2 lists

MaAnt C1 Magnetic CPU BGA Reballing Stencil Kit Platform for A8-A17 Hisilicon Qualcomm MTK EMMC Android Steel Mesh Repair
Shenzhen City Yixin Technology Co., Ltd.🇨🇳CN6 yrs
TX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil

TX T4 Pro Universal Chip Glue Removal and Reballing Platform BGA Repair Jig for iPhone and Android CPU EMMC RAM With 14 Stencil
Shenzhen Fengjiahe Technology Co., Ltd.🇨🇳CN5 yrs
Amaoe Bga Reballing Stencil for iPhone 16 15 14 13 12 11 Pro Max XS Max 8P 8 7 6 A8-A18 Pro CPU Tin Planting Template Solder Kit
Shenzhen Kingmax Technology Co., Ltd.🇨🇳CN5 yrs
RELIFE RL-601T 26 in 1 iPhone X-16 PM 16E Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Repair Kit
Shenzhen Tuohaida Technology Co., Ltd.🇨🇳CN3 yrs
Amaoe for X-17PM 31 in 1 Motherboard Middle Layer Reballing Stencil Platform for iPhone X/11/12/13/14/15/16/17 Phone Repair Tool
Shenzhen Huimin Tong Accessories Co., Ltd.🇨🇳CN5 yrs
JTX T4 Max Metal Glue Removal Planting Platform Qualcomm HiSilicon IP Reballing Stencil Phone IC Chip Repair Clamp

QianLi Mainboard Middle Frame Reballing Platform BGA Reballing Stencil for iPhone 16 15 14 13 12 11 ProMAX LogicBoard Rework
Shenzhen Jueyue Technology Co., Limited🇨🇳CN14 yrs
MaAnt C1 Magnetic CPU BGA Reballing Stencil Kit Platform for iPhone A8-A17 Hisilicon Qualcomm MTK EMMC Android Steel Mesh Repair
Shenzhen Guste Technology Co., Ltd.🇨🇳CN5 yrs
MiJing BGA Reballing Stencil Platform for iPhone X 17 Pro Max Z20 Pro Tin Planting Magnetic Fixture
Shenzhenshi Huozhiyuan Technology Co., Ltd.verified🇨🇳CN5 yrs
MaAnt BGA Reballing Stencil Kit Platform Magnetic IPhone A8-A18 MTK EMMC Qualcomm CPU HUWEI Planting Tin Steel Mesh Weld Repair

AMAOE 4 in 1 Middle Layer Reballing Stencil Kit for Phone 12 12Pro 12proMax Mini With Magnetic Positioning Base
Shenzhen Fengjiahe Technology Co., Ltd.🇨🇳CN5 yrs
AMAOE 4in1 Middle Layer Magnetic Reballing Fixture Stencil Platform Kit for IPhone 16 Pro Max/Plus IP16PM Series Repair Tool

MiJing Z20 Pro BGA Reballing Stencil Platform for X-16 PRO MAX Magnetic Fixture Motherboard Middle Frame Soldering Kits
Shenzhen Vintel Technology Co., Ltd.🇨🇳CN1 yr
503pcs/set BGA Direct Heating Stencils for Reballing Stencils for Laptop iphone samsung Qualcomm
Shenzhen Fundar Technology Limited🇨🇳CN16 yrs
Magnetic Platform Reballing With BGA Stencil For iphone 6G-17 Series CPU RAM A18 A19 Pro A17 A16 A15 A14 A13 A12 A8/A9/A10/A11
Shenzhen Yongyetai Electronics Co., Ltd.🇨🇳CN5 yrs
AMAOE 4-in-1 Middle Layer Magnetic Reballing Fixture Stencil Platform Kit for iPhone 16 Pro Max/Plus IP16PM Series Mobile Phones
Shenzhen Huimin Tong Accessories Co., Ltd.🇨🇳CN5 yrs
MiJing Z20 Pro Mobile BGA Reballing Stencil Kit Platform for iPhone X-17 Pro Max Middle Layer Tin Planting Table Repair Tools
Shenzhen Hodaxin Leather Co., Ltd.🇨🇳CN7 yrs
Amaoe BGA Reballing Stencil Kit for iPhone 15 14 13 12 11 Series X/XS/XS Max/XR/8/8P/7/6S/6 A16 A15 A14 A13/12/A11/A10 0.12mm

QianLi Middle Layer Board Plant Tin Platform Metal BGA Reballing Stencil Kit for iPhone 11 12 13 14 15 16 17 SERIES
Shenzhen Hyperion Lighting Co., Ltd.🇨🇳CN8 yrs
16pcs/lot High Quality Full Set apple Mobile BGA Reballing Stencil Dedicate Kit for iPhone 4 4s 5 5s 5c 5mini 6 6+ 6S 6s+ Etc
Shenzhen Liyang Welding Equipment Co., Ltd.🇨🇳CN15 yrs
Amaoe BGA Reballing Stencil Kit for 15 14 13 12 11 Series X/XS/XS Max/XR/8/8P/7/6S/6 A16 A15 A14 A13/12/A11/A10 0.12mm
Shenzhen City Yixin Technology Co., Ltd.🇨🇳CN6 yrs
Qianli BGA Reballing Stencil for iPhone 13 12 11 Pro Max XS XR X 8 7 6S 6 IC Chip CPU Tin Planting Soldering Template

China Factory Universal BGA IC Reballing Stencil for Iphone X / 8 / 8S Mobile Iphone Repairing Tool Bga Reballing Kit Stencils

Anti-Burst High Quality Universal Mobile IC BGA Reballing Stencil for PCB Rework
Guangzhou Mayuan Electronic Technology Co., Ltd.🇨🇳CN10 yrs
Mechanic IBGA 12 Pro 10 in 1 BGA Reballing Stencil Platform for iPhone X 11 12 13 Pro Max Motherboard Middle Rework Template
Shenzhen Hyperion Lighting Co., Ltd.🇨🇳CN8 yrs
Mobil EMMC/EMCP/UFS suit Positioning plate BGA153/162/169/186/221/254 BGA Stenci reball Kits
Shenzhen LRF Technology Ltd.🇨🇳CN18 yrs
Amaoe TV EMMC 4 In 1 Reballing Stencil BGA153 BGA169 Repair Tools with Mbga-MY3 Net Location Board Magnetic Base
Shenzhen LRF Technology Ltd.🇨🇳CN18 yrs
Mobil EMMC/EMCP/UFS suit Positioning plate BGA153/162/169/186/221/254 BGA Stenci reball Kits

Amaoe TV EMMC 4 In 1 Reballing Stencil BGA153 BGA169 Repair Tools with Mbga-MY3 Net Location Board Magnetic Base
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Sources & References
19 sources cited · Verified industry data & reports

IC Reballing Tools Supplier List
Alibaba.com
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BGA Reballing Service Market Size, Share & Forecast 2035
Market Research Intellect
BGA Reballing Service Market trends show the industry valued at USD 482 Million in 2025 and projected to reach USD 947 Million by 2035, achieving a CAGR of ...

BGA Reballing Service Market Key Trends for 2025
openPR.com
The BGA (Ball Grid Array) Reballing Service market is witnessing significant growth, driven by the increasing demand for high-performance ...
