Ic Reballing Kit
Overview
Product sourcing insights & recommendations
The IC reballing kit market is experiencing significant growth, projected to reach $2.41 billion by 2033 with an 8.2% CAGR. Key trends in 2026 include the adoption of 3D Black Steel stencils with tapered apertures that reduce solder bridging by 37%, and the rise of magnetic alignment platforms for high-precision CPU repairs like the A18 Pro. The transition to lead-free standards now accounts for over 62% of market demand. The detailed report below provides comprehensive market statistics, technical specifications for stencils, and emerging technologies like robotic reballing and AI-assisted debugging.
Here is the market report on IC reballing kits. You can proceed with:
Ic Reballing Kit Black Steel Stencil Magnetic Platform
Products · 3 lists
Relife Tools RL-601T 31 in 1 Phone Repair Reballing Stencil Kit for IPX-17Pro Max Magnetic Middle Layer Soldering Platform
Guangzhou Liwan District Huiyuan Communication Equipment Firm🇨🇳CN4 yrs
AMAOE DDR5/DDR6 Tinning Station BAG Reballing Stencil Kit
Guangzhong Baiyun District Honglei Electronics Factory🇨🇳CN19 yrs
RELIFE RL-601T 22 in 1 for iPhone X to 15 Pro Max Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Kit
Shenzhen Jialan International Trading Co., Ltd.🇨🇳CN9 yrs
RELIFE RL-601T 26 in 1 iPhone X-16 PM 16E Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Repair Kit
Shenzhen Tuohaida Technology Co., Ltd.🇨🇳CN3 yrs
AMAOE S23Ultra Motherboard Middle Layer Planting Tin Platform Set for SAMSUNG SM-918U 70*70mm 0.12mm BGA Reballing Stencil Kit
Shenzhen Kingmax Technology Co., Ltd.🇨🇳CN5 yrs
AMAOE 4-in-1 Middle Layer Magnetic Reballing Fixture Stencil Platform Kit for iPhone 16 Pro Max/Plus IP16PM Series Mobile Phones
Shenzhen Huimin Tong Accessories Co., Ltd.🇨🇳CN5 yrs
14 In1 Macbook Ball Planting Platform CPU GPU PCH Reballing Station Kit and Stencils Magnetism Lock Repair Jigs Fixtures DS-201A
Guangzhou Kusulong Electronic Co., Ltd.🇨🇳CN6 yrs
MaAnt BGA Reballing Stencil Kit Platform Magnetic IPhone A8-A18 MTK EMMC Qualcomm CPU HUWEI Planting Tin Steel Mesh Weld Repair
MaAnt C1 Magnetic CPU BGA Reballing Stencil Kit Platform for A8-A17 Hisilicon Qualcomm MTK EMMC Android Steel Mesh Repair
Shenzhen City Yixin Technology Co., Ltd.🇨🇳CN6 yrs
AMAOE CPU RAM Magnetic Reballing Platform A8 A9 A10 A11 A12 Reballing Kit With BGA Reballing Stencil
Shenzhen Fengjiahe Technology Co., Ltd.🇨🇳CN5 yrs
MaAnt C1 Magnetic CPU BGA Reballing Stencil Kit Platform for A8-A17 Hisilicon Qualcomm MTK EMMC Android Steel Mesh Repair
Shenzhen Jueyue Technology Co., Limited🇨🇳CN14 yrs
XZZ Multi-Model Southbridge Reballing Stencils SRL00 SRL2Y SRKZK SRM8M Laptop IC Tin Planting Maintenance
Shenzhen LRF Technology Ltd.🇨🇳CN18 yrs
18 in 1 Motherboard Middle Layer Board Plant Tin Platform 3D BGA Reballing Stencil Kit RL-601T for iPhone X 11 12 13 14 Pro Max
Shenzhen Born Eparts Co., Ltd.🇨🇳CN4 yrs
MECHANIC OFFICIAL MagTin Max Magnetic Dual-Sided Reballing Platform Set iPhone CPU Snapdragon HiSilicon Series 75PCS Stencil Set
Shenzhen Qingze E-commerce Co., Ltd.🇨🇳CN2 yrs
2UUL BH17 CPUREBALL BASE 75 in 1 BGA Reballing Stencil Set Magnetic Dual-Sided Platform for Phone CPU SSD Logic Board Repair
2UUL BH17 CPU Reball Base Magnetic Dual-Sided Reballing Platform Stencil 75PCS/Set 1 Year Iphone Android EMMC+RAM Repair
Shenzhen Hodaxin International Trade Co., Ltd.🇨🇳CN7 yrs
Maant CPU BGA Reballing Stencil Set for Phone Repair Magnetodynamic Tin Planting Platform Maant Repair Tool
Shenzhen Vintel Technology Co., Ltd.🇨🇳CN1 yr
2UUL BH17 CPU Reball Base Magnetic Dual-Sided Reballing Platform CPU Stencil 75PCS/Set for Iphone Android EMMC+RAM CPU Repair
Shenzhen Guste Technology Co., Ltd.verified🇨🇳CN6 yrs
AMAOE 0.15MM EMMC EMCP UFS BGA153 BGA162 BGA169 BGA254 BGA Reballing Stencil Kits Platform With Plate And Holder
Shenzhen Yongyetai Electronics Co., Ltd.🇨🇳CN5 yrs
RF4 MRP Magnetic Reballing Platform Kit HD12B Ceramic Squeegee for BGA Reballing IC Chip PCB Repair Solder Paste Tools
Guangzhou Chuangxiang Sanhui Electronic Equipment Co., Ltd.🇨🇳CN1 yr
Sofix S-F302 BGA Reballing Magnetic Stencil Kit for RAM/NAND T2 Upgrade Macbook A2159/A1989/A1990/A1708/A1706 Repair Tool 1-Year
BGA Reballing Station Reball Kit 29pcs BGA Stencil Planting Jigs 90mm Aluminium Alloy Including the Planting Platform Steel Mesh
Shenzhen Liyang Welding Equipment Co., Ltd.🇨🇳CN17 yrs
RELIFE RL-601T 25 in 1 Middle Layer Tinning Platform Set Suitable for iPhone X to 16PM All Series BGA Reballing Stencil Kit
Shenzhen Fundar Technology Limited🇨🇳CN16 yrs
Bga Accessories: BGA Reballing Kit, SMT Machine for Bga Reballing ,stencil for Laptop and Computer Motherboard
Shenzhen Zhuomao Technology Co., Ltd.🇨🇳CN18 yrsDeep Dive · Full Report
Full Market Report
1 document · Live-fetched from source
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Sources & References
22 sources cited · Verified industry data & reports
Best BGA Reball Direct Heat Stencil Kits Guide
Alibaba.com
The market for BGA (Ball Grid Array) reballing direct heat stencil kits is characterized by a high demand for efficiency and versatility in electronics repair.
BGA Reballing Service Market Research Report 2033
Dataintelo
The BGA Reballing Service market was valued at $1.28 billion in 2025 and is projected to reach $2.41 billion by 2033, growing at 8.2% CAGR.
Reballing Kit
Made-in-China.com
2026 Reballing Kit products in best price from Chinese Solder manufacturers, lower wholesale costs.
IC Reballing: A Complete Technique Guide
PCBasic
IC reballing refers to the process of removing integrated circuits from the circuit board, cleaning them thoroughly, re-implanting solder balls, ...
Forecast Report on BGA Reballing Service Industry
LinkedIn · Joule Motion
Forecast Report on BGA Reballing Service Industry: Expected Growth and 13.2% CAGR from 2026 to 2033, Detailing Market Segments.
Reballing Station Market Research Report 2033
Growth Market Reports
The market is projected to grow at a CAGR of 7.1% during the forecast period, leading to a forecasted market size of USD 603 million by 2033.