Mediatek Bga

Alibaba.com

Overview

Product sourcing insights & recommendations

www.bccresearch.com
www.deepresearchglobal.com
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Analysis of MediaTek BGA (Ball Grid Array) chipset market trends for 2026 reveals a strategic shift toward premiumization, advanced packaging, and data center expansion.

1. Market Trends & Strategic Shifts

* Dominant Market Share: MediaTek is projected to maintain its position as the global leader in smartphone chipset shipments in 2026 with a 34% market share Wccftech.

* Premiumization Drive: While overall shipment volume may see a minor decline (7%) due to rising DRAM costs, SoC revenue is expected to achieve double-digit growth as one in three smartphones shipped in 2026 is projected to be a premium device Wccftech.

* Upmarket Evolution: MediaTek is aggressively expanding beyond mobile into AI PCs, Data Centers, and Robotics. The company has set a target of $1 billion in data center revenue for 2026 Futurumgroup.

2. Packaging Technology Insights

* 3.5D Advanced Packaging: To support its move into high-performance computing, MediaTek is adopting 3.5D packaging to handle massive silicon areas (up to 20,000 mm²) Futurumgroup.

* Copper Interconnect Solutions: MediaTek is championing Near-package Copper (NPC) and Co-packaged Copper (CPC) as lower-cost, lower-power alternatives to optics for chip-to-chip connectivity Futurumgroup.

* Thermal & Power Efficiency: Advanced BGA configurations now integrate Integrated Voltage Regulators (IVR) directly into the package, adapted from the flagship Dimensity line to manage AI power demands Futurumgroup.

3. Key Product Insights

* Dimensity Series: The flagship Dimensity 9600 (2nm) has successfully taped out and is set to lead the 2026 premium mobile market Wccftech.

* AI PC (DGX Spark): A collaborative platform with Nvidia (GB10 architecture) integrates MediaTek CPUs with Nvidia GPUs on a single BGA package for local AI workflows Futurumgroup.

* Genio IoT Platform: New Genio platforms (360, 420, Pro) were unveiled for robotics and edge AI applications Mediatek.

4. Sourcing & Supply Insights

Current B2B availability for MediaTek BGA components primarily focuses on high-volume mobile CPUs and specialized IoT SoCs. Prices for legacy or mid-range BGA chips (e.g., MT6252, MT6261) range from $0.99 to $3.00 per unit in bulk, while high-performance Dimensity chips can reach over $39 per piece for smaller lots AlibabaAlibabaAlibaba.

The files below provide a detailed breakdown of available MediaTek BGA products and suppliers.

Here are the MediaTek BGA trends and insights. You can continue with:

Mtk Smartphone Bga Chipset Bulk

Products · 2 lists

Mobile Phone CPU Chips MT6252A/D BGA Integrated Circuits Original Brand 5-Day Lead Time Wholesale Price PCBA SMT Service

Mobile Phone CPU Chips MT6252A/D BGA Integrated Circuits Original Brand 5-Day Lead Time Wholesale Price PCBA SMT Service

$2.50-34.9(633)
MOQ: 1 piece
MTK BGA200+ store reviews15% reorder rate≤4h response time
Shenzhen I-Circuit Electronics Co., Ltd.Shenzhen I-Circuit Electronics Co., Ltd.🇨🇳CN3 yrs
Wholesale Integrated Mobile Phone CPU Chips MT6252A/D BGA Mobile ICs Integrated Circuit SMT PCBA Services

Wholesale Integrated Mobile Phone CPU Chips MT6252A/D BGA Mobile ICs Integrated Circuit SMT PCBA Services

$0.995.0(374)
MOQ: 50 pieces
MTK BGA≤1h response time
Shenzhen Junhao Yunxin Technology Co., Ltd.Shenzhen Junhao Yunxin Technology Co., Ltd.🇨🇳CN1 yr
MT6769V New Original CPU Chip IC Mobile Phone Power Chip IC BGA Electronic Components MT6769V/CT

MT6769V New Original CPU Chip IC Mobile Phone Power Chip IC BGA Electronic Components MT6769V/CT

$104.9(629)
MOQ: 1 piece
MTK BGA100+ store reviews36% reorder rate≤1h response time
Shenzhen Xinsheng Pengye Technology Co., Ltd.Shenzhen Xinsheng Pengye Technology Co., Ltd.🇨🇳CN5 yrs
MT6769V New Original MTK CPU Chip IC Mobile Phone Power Chip IC BGA Electronic Components MT6769V/CT

MT6769V New Original MTK CPU Chip IC Mobile Phone Power Chip IC BGA Electronic Components MT6769V/CT

$3-104.7(431)
MOQ: 1 piece
MTK BGA14% reorder rate≤5h response time
Shenzhen Riemann Technology Co., Ltd.Shenzhen Riemann Technology Co., Ltd.🇨🇳CN1 yr
Mt6260 Mobile Phone Cpu Chip Baseband Ic Mt6260da

Mt6260 Mobile Phone Cpu Chip Baseband Ic Mt6260da

$3.08-3.644.4(270)
MOQ: 1 piece
MTK BGA200+ store reviews22% reorder rate≤2h response time
Shenzhen Jinhongyang Technology Co., Ltd.Shenzhen Jinhongyang Technology Co., Ltd.🇨🇳CN9 yrs
Phone Processor Chip iC MT6985W MT8798Z MT6993Z Tianqi 9200 9000 9500 chip

Phone Processor Chip iC MT6985W MT8798Z MT6993Z Tianqi 9200 9000 9500 chip

$1-75.0(578)
MOQ: 5 pieces
MTK BGA14% reorder rate≤1h response time
Shenzhen Shengye Xincheng Technology Co., Ltd.Shenzhen Shengye Xincheng Technology Co., Ltd.🇨🇳CN1 yr
MT6627N/A New and original IC Chips IF Mobile Phone chip QFN40 6627

MT6627N/A New and original IC Chips IF Mobile Phone chip QFN40 6627

$0.10-0.305.0(890)
MOQ: 1 piece
200+ store reviews8% reorder rate≤2h response time
Shenzhen Han Disen Technology Co., Ltd.Shenzhen Han Disen Technology Co., Ltd.🇨🇳CN12 yrs
MT6572A CUP chip BGA mobile phone chip IC mtk ic

MT6572A CUP chip BGA mobile phone chip IC mtk ic

$1.38-2.774.9(147)
MOQ: 1 piece
MTK BGA500+ store reviews30% reorder rate≤5h response time
Shenzhen King Joining Tech Co., Ltd.Shenzhen King Joining Tech Co., Ltd.🇨🇳CN16 yrs
SeekEC New MT6261DA Original MT6261 Package BGA Mobile Phone CPU Chip

SeekEC New MT6261DA Original MT6261 Package BGA Mobile Phone CPU Chip

$1.44-1.544.8(423)
MOQ: 1 piece
MTK BGA800+ store reviews17% reorder rate≤1h response time
Shenzhen Maoxing Weiye Technology Co., Ltd.Shenzhen Maoxing Weiye Technology Co., Ltd.verified🇨🇳CN5 yrs
MT5751YAAT/MCZA BGA MediaTek ( MTK )  chip  =MSD

MT5751YAAT/MCZA BGA MediaTek ( MTK ) chip =MSD

$39.645.0(653)
MOQ: 1 piece
MTK BGA9% reorder rate≤4h response time
Shenzhen Longhua District Liuliqiao Electronic Firm (Individual Business)Shenzhen Longhua District Liuliqiao Electronic Firm (Individual Business)🇨🇳CN1 yr

Sources & References

28 sources cited · Verified industry data & reports

Market Research Reports Featuring MediaTek

www.bccresearch.com

Explore the global 5G chipset market size and share, with insights on device demand, infrastructure growth, key players, and forecasts to 2030. Published - Jun 2025| Analyst - BCC Publishing| Code - IFT310A · BCC Research Report: Dive into edge ai market market trends includes global revenue ($ Million) for the base year data 2024, estimated data for 2025, and the forecast data for 2026 through 2030. The report provides an overview of the global market for microprocessor in embedded applications and analyzes market trends · Published - Feb 2022| Analyst - BCC Publishing| Code - HLC185C · BCC Research Market Report for Health Self-monitoring Device. Health Self-monitoring market projections through 2026, detailing the market share for based on the technologies and COVID-19 impact. Published - Dec 2021| Analyst - BCC Publishing| Code - SMC131A · BCC Research Market Report for Global Semiconductor Chip Shortage Study with Focus on Applications segmented based on type, end-users, and geography. BCC Research Market Report says Internet of Things (IoT) technologies is estimated to grow from $370.5 billion in 2021 to reach $1.3 trillion by 2026, at a CAGR of 27.6%. Published - Jul 2021| Analyst - BCC Publishing| Code - SMC129A · BCC Research Market Report says wi-fi 6 chipsets should grow from $3.4 billion in 2021 to $9.1 billion by 2026, at compound annual growth rate (CAGR) of 21.7% BCC Research Market Report says wireless connectivity technologies is estimated to grow from $65.2 billion in 2021 to $130.6 billion by 2026, at a (CAGR) of 14.9% Published - Aug 2019| Analyst - Srinivasa Rajaram| Code - IAS010H · The global market for machine vision system should grow from $19.6 billion in 2019 to $31.1 billion by 2024 at a compound annual growth rate of 9.7% from 2019 to 2024. Published - Aug 2019| Analyst - BCC Publishing| Code - IAS151A · Market research report on top 10 Chipset companies.

MediaTek - SWOT Analysis Report (2026)

www.deepresearchglobal.com

With approximately 2 billion connected devices powered by MediaTek chipsets annually, the company’s influence extends across multiple technology sectors. ... As we examine MediaTek’s strategic position for 2026 and beyond, this analysis draws upon the company’s recent financial performance, technological innovations, competitive dynamics, and market trends. Our comprehensive MediaTek SWOT analysis draws upon company’s recent financial performance, technological innovations, competitive dynamics, and market trends. Emerging markets in India, Southeast Asia, Latin America, and Africa represent massive growth opportunities as 5G adoption accelerates. MediaTek’s strength in cost-effective chipsets positions the company perfectly for this secular trend. Export Controls: Tightening semiconductor export controls could restrict MediaTek’s access to advanced manufacturing processes, electronic design automation software, or key markets. Tariff Uncertainty: CEO Rick Tsai has acknowledged uncertainty regarding US-China tariff policies, which could increase costs or reduce competitiveness if chipsets face new duties. Technology Decoupling: The broader trend toward technological decoupling between the US and China creates uncertainty for companies serving both markets with globally integrated supply chains.

MediaTek Estimated To Remain The Global Smartphone Chipset ...

wccftech.com

Samsung - 11.2 percent in 2025, declined to 12.1 percent in 2026 · Like MediaTek, Apple and Qualcomm are also expected to witness a decline, but both firms are in a better position because of the ongoing ‘premiumization trend,’ where consumers upgrade to top-end devices simply because it’s an iPhone or it is equipped with a Snapdragon silicon. Also, the DRAM crisis might contribute to lower chipset shipments, but Counterpoint Research’s senior analyst Soumen Mandal has said that rising memory prices will be one of the reasons for the SoC’s double-digit revenue growth. Even though MediaTek has been reported to be hit the hardest out of all chipset manufacturers because more than half of its quarterly revenue comes to SoC shipments, Counterpoint Research believes that the Taiwanese fabless semiconductor manufacturer will still retain a healthy global market share of 34 percent, down from 34.4 percent (various figures are listed below): MediaTek - 34.4 percent in 2025, declined to 34 percent in 2026 The increase in DRAM prices resulting from the shortage will partially account for the decline in global smartphone chipset shipments in 2026, according to research firm Counterpoint Research, with the latest data showing MediaTek will retain its position as the dominant player. Thankfully, despite the volume reduction, SoC revenue is set to grow in double digits for this year, as every one in three smartphones shipped in 2026 is expected to be a premium device. Apple and Qualcomm are expected to benefit greatly from higher-priced handset shipments. As we move towards the launch of 2nm chipsets, MediaTek, Apple, and Qualcomm are expected to focus on architectural improvements to their SoCs, along with cache increases that will allow all three companies to introduce their best silicon yet.

MediaTek - Wikipedia

en.wikipedia.org

MediaTek is developing an Arm-based PC chip for Microsoft's Windows, set to launch after Qualcomm's exclusivity ends in 2024. This move aims to challenge Apple's Arm-based Macs and Intel's dominance in the PC market. Nvidia and AMD are also working on similar Arm-based designs for Windows. Nvidia launched its RTX Spark series in Computex 2026, co-developed in partnership with Mediatek. MediaTek Inc. (Chinese: 聯發科技股份有限公司; pinyin: Liánfā Kējì Gǔfèn Yǒuxiàn Gōngsī), sometimes informally abbreviated as MTK, is a Taiwanese fabless semiconductor company that designs and markets a range of semiconductor products, providing chips for wireless communications, high-definition television, handheld mobile devices like smartphones and tablet computers, navigation systems, consumer multimedia products and digital subscriber line services as well as optical disc drives. Founded in 1997 and headquartered in Hsinchu, the company has 41 offices worldwide and was the third largest fabless chip designer worldwide in 2016. The company also provides its customers with reference designs. MediaTek became the biggest smartphone chipset vendor with 31% market share in Q3 2020. The company started out designing chipsets for optical drives and subsequently expanded into chips for DVD players, digital TVs, mobile phones, smartphones and tablets. In general MediaTek has had a strong record of gaining market share and displacing competitors after entering new markets. The mobile chip market quickly became the main growth driver for the company. At Mobile World Congress 2014, MediaTek unveiled its new brand "Everyday Genius", dubbing the term "Super-mid market", with the vision and aiming to make smartphones more accessible affordable to the wider market.

Semiconductor Industry Outlook 2026: Aligning Product Portfolios ...

www.abiresearch.com

Prioritize high-margin AI and data center segments, while managing exposure to consumer markets. Invest in advanced packaging and integration (e.g., High-Bandwidth Memory (HBM), chiplets) to maximize performance. Establish long-term supply agreements and ecosystem partnerships with hyperscalers. Semiconductor giants like MediaTek and Qualcomm drove the Wi-Fi 8 narrative at CES and MWC26. Our analysts have recently attended marquee technology conferences in 2026 to meet directly with the world’s leading semiconductor firms. Through the first quarter of the year, our team has synthesized deep insights from the Consumer Electronics Show (CES), Mobile World Congress (MWC) Barcelona, embedded world, and NVIDIA GTC. In tandem with conversations with semiconductors, the team has identified several transformative trends that will redefine what it means to be an innovative foundry, fabless chipmaker, or software provider. Embed native security features (e.g., RoT, cryptography) across all chipsets. Invest in PQC readiness and crypto-agility. Provide integration, customization, and certification support to meet OEM requirements. Robotics is the next major growth lever for semiconductors, especially as automotive business wanes. According to ABI Research, revenue from robotics semiconductors will increase from US$1.47 billion in 2026 to US$4.9 billion by 2035. Processing holds the lion’s share of the market (learn more in our Charts & Data). The result is a robotics-first chipset that lets humanoids complete tasks as complex as sorting fruit onto plates of the same color. ABI Research Principal Analyst George Chowdhury noted similar demos and announcements at CES 2026 from Ambarella, AMD, and NVIDIA. He also stated that “Other silicon vendors, including NXP, Microchip, and STMicroelectronics, have a renewed interest in the market and are discovering the best ways to meet the demands of a potential boom.” Chowdhury explains that Big Tech, hyperscalers, and automotive vendors will also want to board the robotics hype train.

Ball Grid Array (BGA) Packaging Market Size, Share, and Industry ...

markwideresearch.com

The Ball Grid Array (BGA) Packaging Market is estimated at $18.7 Billion in 2026 and is projected to expand to $38.65 Billion by 2035, advancing at a 8.40% CAGR over the analysis window. Semiconductor demand from automotive electronics is intensifying as EV powertrain and ADAS modules require higher I/O density interconnects. Consolidated procurement consortia among fabless semiconductor designers are displacing fragmented spot-market purchasing for BGA substrates and bumping services. Apple, Qualcomm, and MediaTek have established multi-year capacity reservations with ABF laminate suppliers, forcing second-tier AP vendors into residual allocation queues. ASE Technology Holding Co. Ltd. sustains its position through geographic diversification across Kaohsiung, Chungli, and Shanghai facilities. Amkor Technology competes aggressively in advanced SiP and flip-chip BGA configurations for mobile AP and baseband markets. Ball Grid Array (BGA) packaging arranges solder balls in a grid pattern on the package underside, enabling pitch densities below 0.5mm and thermal resistance characteristics critical for high-pin-count processors and memory stacks. The architecture replaces peripheral lead frames with area-array interconnects, permitting higher I/O counts within equivalent or smaller footprints than quad flat packages. Flip Chip BGA and Micro BGA segments command premium positioning as smartphone SoCs and automotive radar modules drive finer-pitch requirements.